| Quantity: | |
|---|---|
CHEMICAL COMPOSITION
C: 0.30-0.38
Si: ≤ 0.4
Mn: 0.5-0.8
Cr: 1.3-1.7
Ni: 1.3-1.7
Mo: 0.15-0.3
P: ≤ 0.025
S: ≤ 0.035
MECHANICAL PROPERTIES
Tensile Strength: ≥980Mpa
Yield Strength: ≥835Mpa
Elongation: ≥16%
Reduction of Area: ≥50%
Impact Charpy-V,+21°C: ≥54J
Hardness: 28-32HRC
PHYSICAL PROPERTIES
Density: 7.78 g/cm3
Specific heat capacity: 0.46 kJ/(kg*K)
Linear expansion coefficient: 11.7 K-1
Thermal conductivity: 0.348 W/(cm*K)
Electrical resistivity: 0.256 Ω*cm
Young's modulus: 21.0 kG/mm2
HEAT TREATMENT
Forging: 1050-850 °C
Rolling: 1180-850 °C
Quenching: 830-860 °C
Tempering: 540-680 °C
Normalizing annealing: 850-880 °C
Soft annealing: 680-720 °C
CHEMICAL COMPOSITION
C: 0.30-0.38
Si: ≤ 0.4
Mn: 0.5-0.8
Cr: 1.3-1.7
Ni: 1.3-1.7
Mo: 0.15-0.3
P: ≤ 0.025
S: ≤ 0.035
MECHANICAL PROPERTIES
Tensile Strength: ≥980Mpa
Yield Strength: ≥835Mpa
Elongation: ≥16%
Reduction of Area: ≥50%
Impact Charpy-V,+21°C: ≥54J
Hardness: 28-32HRC
PHYSICAL PROPERTIES
Density: 7.78 g/cm3
Specific heat capacity: 0.46 kJ/(kg*K)
Linear expansion coefficient: 11.7 K-1
Thermal conductivity: 0.348 W/(cm*K)
Electrical resistivity: 0.256 Ω*cm
Young's modulus: 21.0 kG/mm2
HEAT TREATMENT
Forging: 1050-850 °C
Rolling: 1180-850 °C
Quenching: 830-860 °C
Tempering: 540-680 °C
Normalizing annealing: 850-880 °C
Soft annealing: 680-720 °C
